Numerical Simulation of Boundary Condition Dependence of Mask Pattern Placement Error by Finite Difference Method in Steady State

Numerical Simulation of Boundary Condition Dependence of Mask Pattern Placement Error by Finite Difference Method in Steady State

A photomask for semiconductor device production faces serious problems related to the thermal displacement of the mask pattern during exposure. During mask exposure, pattern placement error occurs in the mask. The minimization of thermal in-plane displacement is needed. To estimate thermal displacem...

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Bibliographic Details
Main Authors: Akira CHIBA, Souta MATSUSAKA, Hirofumi HIDAI, Noboru MORITA
Format: Article
Language:English
Published: The Japan Society of Mechanical Engineers 2013-05-01
Series:Journal of Advanced Mechanical Design, Systems, and Manufacturing
Subjects:
mask
numerical calculation
pattern placement error
thermal displacement
exposure
in-plane stress
boundary condition
heat source
temperature rise
Online Access:https://www.jstage.jst.go.jp/article/jamdsm/7/3/7_398/_pdf/-char/en

Internet

https://www.jstage.jst.go.jp/article/jamdsm/7/3/7_398/_pdf/-char/en

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