A RF Redundant TSV Interconnection for High Resistance Si Interposer

A RF Redundant TSV Interconnection for High Resistance Si Interposer

Through Silicon Via (TSV) technology is capable meeting effective, compact, high density, high integration, and high-performance requirements. In high-frequency applications, with the rapid development of 5G and millimeter-wave radar, the TSV interposer will become a competitive choice for radio fre...

Full description

Bibliographic Details
Main Authors: Mengcheng Wang, Shenglin Ma, Yufeng Jin, Wei Wang, Jing Chen, Liulin Hu, Shuwei He
Format: Article
Language:English
Published: MDPI AG 2021-02-01
Series:Micromachines
Subjects:
millimeter-wave
redundant TSV
equivalent circuit model
S-parameters extraction
Online Access:https://www.mdpi.com/2072-666X/12/2/169

Internet

https://www.mdpi.com/2072-666X/12/2/169

Similar Items