Rapid formation, grain refinement and shear property of high-temperature-stable full IMC joints
Solid liquid interdiffusion (SLID) bonding that can fabricate high-melting point full IMC joints is playing an increasing key role in 3rd-generation semiconductor power electronic device packaging for high temperature applications. In this study, rapid formation of Cu/intermetallic compounds (IMCs)/...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423009237 |