Influence of Hydrophobic Fin Configuration in Thermal System in Relation to Electronic Device Cooling Applications
In this study, heat and flow analysis of the cooling system incorporating fins with hydrophilic and hydrophobic wetting surfaces has been considered in relation to electronic cooling applications. Temperature and velocity fields in the solution domain are simulated for various fin numbers and sizes....
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-04-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/13/7/1631 |