High aspect ratio grooving of Si using a wet etching assisted by wire-friction (A feasibility study for the applicaiotn for slicing Si ingots)
Silicon (Si) wafers for electronic or photovoltaic devices are fabricated by slicing a Si ingot using mechanical slicing with a diamond wire. Recently, the slicing method without generating damage on Si surface has been strongly required because of the increasing demand of ultra-thin Si wafers. In t...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | Japanese |
| Published: |
The Japan Society of Mechanical Engineers
2014-07-01
|
| Series: | Nihon Kikai Gakkai ronbunshu |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/transjsme/80/815/80_2014smm0183/_pdf/-char/en |