Optimization of substrate conformal imprint lithography (SCIL) and etching for nanostructure
The UV-SCIL fabrication process was developed and optimized to improve the quality of the nanostructures on the hard substrate transferred with substrate conformal imprint lithography (SCIL) technology. In particular, the key steps such as coating imprint resist, exposure time and etching time were...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2015-04-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.4904061 |
| _version_ | 1818128900947968000 |
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| author | Zhaoxin Geng Xiangbin Guo Qiang Kan Hongda Chen |
| author_facet | Zhaoxin Geng Xiangbin Guo Qiang Kan Hongda Chen |
| author_sort | Zhaoxin Geng |
| collection | DOAJ |
| description | The UV-SCIL fabrication process was developed and optimized to improve the quality of the nanostructures on the hard substrate transferred with substrate conformal imprint lithography (SCIL) technology. In particular, the key steps such as coating imprint resist, exposure time and etching time were investigated thoroughly. The experiment’s results illustrate that imprint resist could well serve as an etching mask for the dry etching process without oxygen plasma. The optimized etching condition and SCIL technology could also be used to transfer nanostructures on different substrates for metal nanostructured biosensors or nanophotonics. |
| first_indexed | 2024-12-11T07:40:36Z |
| format | Article |
| id | doaj.art-f32decc89b9b4fbf87130c0b1e79c769 |
| institution | Directory Open Access Journal |
| issn | 2158-3226 |
| language | English |
| last_indexed | 2024-12-11T07:40:36Z |
| publishDate | 2015-04-01 |
| publisher | AIP Publishing LLC |
| record_format | Article |
| series | AIP Advances |
| spelling | doaj.art-f32decc89b9b4fbf87130c0b1e79c7692022-12-22T01:15:35ZengAIP Publishing LLCAIP Advances2158-32262015-04-0154041308041308-610.1063/1.4904061008593ADVOptimization of substrate conformal imprint lithography (SCIL) and etching for nanostructureZhaoxin Geng0Xiangbin Guo1Qiang Kan2Hongda Chen3School of Information Engineering, Minzu University of China, 100081, ChinaSchool of Information Engineering, Minzu University of China, 100081, ChinaInstitute of Semiconductors, Chinese Academy of Sciences, 100083, ChinaInstitute of Semiconductors, Chinese Academy of Sciences, 100083, ChinaThe UV-SCIL fabrication process was developed and optimized to improve the quality of the nanostructures on the hard substrate transferred with substrate conformal imprint lithography (SCIL) technology. In particular, the key steps such as coating imprint resist, exposure time and etching time were investigated thoroughly. The experiment’s results illustrate that imprint resist could well serve as an etching mask for the dry etching process without oxygen plasma. The optimized etching condition and SCIL technology could also be used to transfer nanostructures on different substrates for metal nanostructured biosensors or nanophotonics.http://dx.doi.org/10.1063/1.4904061 |
| spellingShingle | Zhaoxin Geng Xiangbin Guo Qiang Kan Hongda Chen Optimization of substrate conformal imprint lithography (SCIL) and etching for nanostructure AIP Advances |
| title | Optimization of substrate conformal imprint lithography (SCIL) and etching for nanostructure |
| title_full | Optimization of substrate conformal imprint lithography (SCIL) and etching for nanostructure |
| title_fullStr | Optimization of substrate conformal imprint lithography (SCIL) and etching for nanostructure |
| title_full_unstemmed | Optimization of substrate conformal imprint lithography (SCIL) and etching for nanostructure |
| title_short | Optimization of substrate conformal imprint lithography (SCIL) and etching for nanostructure |
| title_sort | optimization of substrate conformal imprint lithography scil and etching for nanostructure |
| url | http://dx.doi.org/10.1063/1.4904061 |
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