Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN
Significant downsizing trend is currently directing the advanced microelectronic packaging industry, which poses new challenges to the manufacturing process and reliability of high-density chip interconnections. In this paper, to investigate the size effect of microbump joints on the interfacial str...
| Үндсэн зохиолчид: | , , , , , |
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| Формат: | Өгүүллэг |
| Хэл сонгох: | English |
| Хэвлэсэн: |
Elsevier
2022-05-01
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| Цуврал: | Journal of Materials Research and Technology |
| Нөхцлүүд: | |
| Онлайн хандалт: | http://www.sciencedirect.com/science/article/pii/S2238785422004173 |