Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN

Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN

Significant downsizing trend is currently directing the advanced microelectronic packaging industry, which poses new challenges to the manufacturing process and reliability of high-density chip interconnections. In this paper, to investigate the size effect of microbump joints on the interfacial str...

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Bibliografiska uppgifter
Huvudupphovsmän: Chu Tang, Zhuo Chen, Mingang Fang, Xiaoyu Xiao, Gui Chen, Wenhui Zhu
Materialtyp: Artikel
Språk:English
Publicerad: Elsevier 2022-05-01
Serie:Journal of Materials Research and Technology
Ämnen:
Interfacial reactions
Shear strength
Size effect
Intermetallics
Artificial neural network
Microbump interconnection
Länkar:http://www.sciencedirect.com/science/article/pii/S2238785422004173

Internet

http://www.sciencedirect.com/science/article/pii/S2238785422004173

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