Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes

Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes

MEMS gyroscopes are widely applied in consumer electronics, aerospace, missile guidance, and other fields. Reliable packaging is the foundation for ensuring the survivability and performance of the sensor in harsh environments, but gas leakage models of wafer-level MEMS gyroscopes are rarely reporte...

Full description

Bibliographic Details
Main Authors: Yingyu Xu, Shuibin Liu, Chunhua He, Heng Wu, Lianglun Cheng, Qinwen Huang, Guizhen Yan
Format: Article
Language:English
Published: MDPI AG 2023-10-01
Series:Micromachines
Subjects:
MEMS gyroscope
quality factor
packaging reliability
wafer-level vacuum sealing
degradation model
Online Access:https://www.mdpi.com/2072-666X/14/10/1956

Internet

https://www.mdpi.com/2072-666X/14/10/1956

Similar Items