Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor Manufacturing
This paper studies the AWC (Active Wafer Centering) algorithm for the movement control and wafer calibration of the handling robot in semiconductor manufacturing to prevent wafer surface contact and contamination during the transfer process. The mechanical and software architecture of the wafer-hand...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-10-01
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| Series: | Sensors |
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| Online Access: | https://www.mdpi.com/1424-8220/23/20/8502 |
| _version_ | 1797572363852709888 |
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| author | Bing-Yuan Han Bin Zhao Ruo-Huai Sun |
| author_facet | Bing-Yuan Han Bin Zhao Ruo-Huai Sun |
| author_sort | Bing-Yuan Han |
| collection | DOAJ |
| description | This paper studies the AWC (Active Wafer Centering) algorithm for the movement control and wafer calibration of the handling robot in semiconductor manufacturing to prevent wafer surface contact and contamination during the transfer process. The mechanical and software architecture of the wafer-handling robot is analyzed first, which is followed by a description of the experimental platform for semiconductor manufacturing methods. Secondly, the article utilizes the geometric method to analyze the kinematics of the semiconductor robot, and it decouples the motion control of the robot body from the polar coordinates and joint space. The wafer center position is calibrated using the generalized least-square inverse method for AWC correction. The AWC algorithm is divided into calibration, deviation correction, and retraction detection. These are determined by analyzing the robot’s wafer calibration process. In conclusion, the semiconductor robot’s motion control and AWC algorithm are verified through experiments for correctness, feasibility, and effectiveness. After the wafer correction, the precision of AWC is <± 0.15 mm, which meets the requirements for transferring robot wafers. |
| first_indexed | 2024-03-10T20:55:13Z |
| format | Article |
| id | doaj.art-f3aa8e4314ed48d0b6f79beb6a88ab56 |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2024-03-10T20:55:13Z |
| publishDate | 2023-10-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-f3aa8e4314ed48d0b6f79beb6a88ab562023-11-19T18:03:53ZengMDPI AGSensors1424-82202023-10-012320850210.3390/s23208502Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor ManufacturingBing-Yuan Han0Bin Zhao1Ruo-Huai Sun2College of Information and Electrical Engineering, China Agricultural University, Beijing 110819, ChinaSIASUN Robot & Automation Co., Ltd., Shenyang 110168, ChinaSIASUN Robot & Automation Co., Ltd., Shenyang 110168, ChinaThis paper studies the AWC (Active Wafer Centering) algorithm for the movement control and wafer calibration of the handling robot in semiconductor manufacturing to prevent wafer surface contact and contamination during the transfer process. The mechanical and software architecture of the wafer-handling robot is analyzed first, which is followed by a description of the experimental platform for semiconductor manufacturing methods. Secondly, the article utilizes the geometric method to analyze the kinematics of the semiconductor robot, and it decouples the motion control of the robot body from the polar coordinates and joint space. The wafer center position is calibrated using the generalized least-square inverse method for AWC correction. The AWC algorithm is divided into calibration, deviation correction, and retraction detection. These are determined by analyzing the robot’s wafer calibration process. In conclusion, the semiconductor robot’s motion control and AWC algorithm are verified through experiments for correctness, feasibility, and effectiveness. After the wafer correction, the precision of AWC is <± 0.15 mm, which meets the requirements for transferring robot wafers.https://www.mdpi.com/1424-8220/23/20/8502Integrated Circuit (IC)handling robotmotion controlActive Wafer Centering algorithm |
| spellingShingle | Bing-Yuan Han Bin Zhao Ruo-Huai Sun Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor Manufacturing Sensors Integrated Circuit (IC) handling robot motion control Active Wafer Centering algorithm |
| title | Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor Manufacturing |
| title_full | Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor Manufacturing |
| title_fullStr | Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor Manufacturing |
| title_full_unstemmed | Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor Manufacturing |
| title_short | Research on Motion Control and Wafer-Centering Algorithm of Wafer-Handling Robot in Semiconductor Manufacturing |
| title_sort | research on motion control and wafer centering algorithm of wafer handling robot in semiconductor manufacturing |
| topic | Integrated Circuit (IC) handling robot motion control Active Wafer Centering algorithm |
| url | https://www.mdpi.com/1424-8220/23/20/8502 |
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