Hardness and thermal conductivity of Cu-carbon composites by using different carbon-based fillers
Nowadays copper matrix composites are of keen interest due to their increasing demand in thermal packaging systems and the electronic industry. In this study, Cu matrix composites are fabricated by using different fillers (graphite, reduced graphene oxide and graphene) by adopting the simple flake p...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-02-01
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| Series: | Results in Physics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379721011153 |