A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit Tests

A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit Tests

When performing In-Circuit Tests (ICTs) of Printed Circuit Boards (PCBs), there are certain phenomena related with strain analysis that must be known in order to obtain stronger and more accurate testing results. During testing, PCBs are often subjected to mechanical bending efforts that induce exce...

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Bibliographic Details
Main Authors: Rui Oliveira, Luís Freitas, Diogo Costa, José Vicente, Arminda Manuela Gonçalves, Teresa Malheiro, José Machado
Format: Article
Language:English
Published: MDPI AG 2022-02-01
Series:Machines
Subjects:
In-Circuit Test (ICT)
Printed Circuit Board (PCB)
bending
strain
Finite Elements Analysis (FEA)
Finite Elements Model (FEM)
Online Access:https://www.mdpi.com/2075-1702/10/2/135

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https://www.mdpi.com/2075-1702/10/2/135

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