A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit Tests
When performing In-Circuit Tests (ICTs) of Printed Circuit Boards (PCBs), there are certain phenomena related with strain analysis that must be known in order to obtain stronger and more accurate testing results. During testing, PCBs are often subjected to mechanical bending efforts that induce exce...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-02-01
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| Series: | Machines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-1702/10/2/135 |
| _version_ | 1797478582159671296 |
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| author | Rui Oliveira Luís Freitas Diogo Costa José Vicente Arminda Manuela Gonçalves Teresa Malheiro José Machado |
| author_facet | Rui Oliveira Luís Freitas Diogo Costa José Vicente Arminda Manuela Gonçalves Teresa Malheiro José Machado |
| author_sort | Rui Oliveira |
| collection | DOAJ |
| description | When performing In-Circuit Tests (ICTs) of Printed Circuit Boards (PCBs), there are certain phenomena related with strain analysis that must be known in order to obtain stronger and more accurate testing results. During testing, PCBs are often subjected to mechanical bending efforts that induce excessive strain. This study focuses on the building of a Finite Elements Analysis (FEA) methodology that prevents excessive bending strain in critical points of a PCB during an ICT. To validate this methodology, a set of experimental tests, matched with a set of FEA, were carried out. Thus, companies, before the development of an ICT machine (fixture), will be able to use this FEA methodology to predict whether the maximum strain of a PCB under study, when subjected to its ICT, will damage it, thus reducing unnecessary production costs. A guideline was thus designed to enable the creation of the most representative Finite Elements Model (FEM) for any PCB, based on its amount and direction of copper traces. |
| first_indexed | 2024-03-09T21:34:51Z |
| format | Article |
| id | doaj.art-f42134e9c3e94804804dad7bd8aec823 |
| institution | Directory Open Access Journal |
| issn | 2075-1702 |
| language | English |
| last_indexed | 2024-03-09T21:34:51Z |
| publishDate | 2022-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Machines |
| spelling | doaj.art-f42134e9c3e94804804dad7bd8aec8232023-11-23T20:48:47ZengMDPI AGMachines2075-17022022-02-0110213510.3390/machines10020135A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit TestsRui Oliveira0Luís Freitas1Diogo Costa2José Vicente3Arminda Manuela Gonçalves4Teresa Malheiro5José Machado6MEtRICs Research Centre, Guimarães, School of Engineering, University of Minho, 4800-058 Guimarães, PortugalMEtRICs Research Centre, Guimarães, School of Engineering, University of Minho, 4800-058 Guimarães, PortugalMEtRICs Research Centre, Guimarães, School of Engineering, University of Minho, 4800-058 Guimarães, PortugalInsideLimits, Rua do Rodelo, 4400-569 Canidelo, PortugalCMAT Research Centre, School of Sciences, University of Minho, 4800-058 Guimarães, PortugalCMAT Research Centre, School of Sciences, University of Minho, 4800-058 Guimarães, PortugalMEtRICs Research Centre, Guimarães, School of Engineering, University of Minho, 4800-058 Guimarães, PortugalWhen performing In-Circuit Tests (ICTs) of Printed Circuit Boards (PCBs), there are certain phenomena related with strain analysis that must be known in order to obtain stronger and more accurate testing results. During testing, PCBs are often subjected to mechanical bending efforts that induce excessive strain. This study focuses on the building of a Finite Elements Analysis (FEA) methodology that prevents excessive bending strain in critical points of a PCB during an ICT. To validate this methodology, a set of experimental tests, matched with a set of FEA, were carried out. Thus, companies, before the development of an ICT machine (fixture), will be able to use this FEA methodology to predict whether the maximum strain of a PCB under study, when subjected to its ICT, will damage it, thus reducing unnecessary production costs. A guideline was thus designed to enable the creation of the most representative Finite Elements Model (FEM) for any PCB, based on its amount and direction of copper traces.https://www.mdpi.com/2075-1702/10/2/135In-Circuit Test (ICT)Printed Circuit Board (PCB)bendingstrainFinite Elements Analysis (FEA)Finite Elements Model (FEM) |
| spellingShingle | Rui Oliveira Luís Freitas Diogo Costa José Vicente Arminda Manuela Gonçalves Teresa Malheiro José Machado A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit Tests Machines In-Circuit Test (ICT) Printed Circuit Board (PCB) bending strain Finite Elements Analysis (FEA) Finite Elements Model (FEM) |
| title | A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit Tests |
| title_full | A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit Tests |
| title_fullStr | A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit Tests |
| title_full_unstemmed | A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit Tests |
| title_short | A Systematic Analysis of Printed Circuit Boards Bending during In-Circuit Tests |
| title_sort | systematic analysis of printed circuit boards bending during in circuit tests |
| topic | In-Circuit Test (ICT) Printed Circuit Board (PCB) bending strain Finite Elements Analysis (FEA) Finite Elements Model (FEM) |
| url | https://www.mdpi.com/2075-1702/10/2/135 |
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