A Review on Phase Field Modeling for Formation of η-Cu<sub>6</sub>Sn<sub>5</sub> Intermetallic
Formation of intermetallic compounds (IMCs) exhibits remarkable microstructural features and provides opportunities for microstructure control of microelectronic interconnects. Excessive formation of brittle IMCs at the Cu/Sn interface such as η-Cu<sub>6</sub>Sn<sub>5</sub> c...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-11-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/12/12/2043 |