Solidification microstructure of Cu–Cr and Cu–Cr-In alloys

Solidification microstructure of Cu–Cr and Cu–Cr-In alloys has been characterized using scanning electron microscopy in the present work. Thermodynamic database has been established for the Cu–Cr binary system and Cu–Cr-In ternary system. Solidification behaviors of the two alloys have been simulate...

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Bibliographic Details
Main Authors: Yunqing Zhu, Jinfa Liao, Huiming Chen, Hang Wang, Bin Yang
Format: Article
Language:English
Published: IOP Publishing 2020-01-01
Series:Materials Research Express
Subjects:
Online Access:https://doi.org/10.1088/2053-1591/ab8259