Effect of Anisotropy on Shape Measurement Accuracy of Silicon Wafer Using Three-Point-Support Inverting Method
This paper describes the influences of anisotropy found in the elastic modulus of monocrystalline silicon wafers on the measurement accuracy of the three-point-support inverting method which can measure the warp and thickness of thin large panels simultaneously. Deflection due to gravity depends on...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Japan Society of Mechanical Engineers
2010-08-01
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| Series: | Journal of Advanced Mechanical Design, Systems, and Manufacturing |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/jamdsm/4/5/4_5_1066/_pdf/-char/en |