Large‐Area Flexible Thin Film Encapsulation with High Barrier and Super‐Hydrophobic Property

Abstract With the development of optoelectronic devices toward miniaturization, flexibility, and large‐scale integration, conventional submillimeter rigid encapsulation techniques rarely achieve conformational functionality while blocking water and oxygen. At the same time, the sensitivity of electr...

Full description

Bibliographic Details
Main Authors: Chao Li, Shizhong Yue, Wang Tian, Yumin Ye, Jun Liu, Yanbin Huang, Zhitao Huang, Yulin Wu, Jiaqian Sun, Zeren Zhao, Keqian Dong, Kong Liu, Zhijie Wang, Shengchun Qu
Format: Article
Language:English
Published: Wiley-VCH 2023-06-01
Series:Advanced Materials Interfaces
Subjects:
Online Access:https://doi.org/10.1002/admi.202300172