Large‐Area Flexible Thin Film Encapsulation with High Barrier and Super‐Hydrophobic Property
Abstract With the development of optoelectronic devices toward miniaturization, flexibility, and large‐scale integration, conventional submillimeter rigid encapsulation techniques rarely achieve conformational functionality while blocking water and oxygen. At the same time, the sensitivity of electr...
Main Authors: | , , , , , , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
Wiley-VCH
2023-06-01
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Series: | Advanced Materials Interfaces |
Subjects: | |
Online Access: | https://doi.org/10.1002/admi.202300172 |