Interface Modulation for the Heterointegration of Diamond on Si

Interface Modulation for the Heterointegration of Diamond on Si

Abstract Along with the increasing integration density and decreased feature size of current semiconductor technology, heterointegration of the Si‐based devices with diamond has acted as a promising strategy to relieve the existing heat dissipation problem. As one of the heterointegration methods, t...

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Bibliographic Details
Main Authors: Xing Li, Li Wan, Chaonan Lin, Wen‐Tao Huang, Jing Zhou, Jie Zhu, Xun Yang, Xigui Yang, Zhenfeng Zhang, Yandi Zhu, Xiaoyan Ren, Ziliang Jin, Lin Dong, Shaobo Cheng, Shunfang Li, Chongxin Shan
Format: Article
Language:English
Published: Wiley 2024-06-01
Series:Advanced Science
Subjects:
β‐SiC
electron microscopy
heterointegration
interfacial structure
MPCVD diamond
Online Access:https://doi.org/10.1002/advs.202309126

Internet

https://doi.org/10.1002/advs.202309126

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