Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints
Thermal fatigue generally occurs in ultrasonically bonded copper joints in electronic devices as the bonding substrate is composed of plural materials, leading to differences in the coefficient of thermal expansion. In this study, we found that the thermal fatigue resistance of the ultrasonically bo...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-04-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/9/8/1556 |