Mechanical simulation for the bending process of the AMOLED panel pad

Mechanical simulation for the bending process of the AMOLED panel pad

Panel pad bending is a critical process to improve the screen-to-body ratio of an active-matrix organic light-emitting diode (AMOLED) panel. The failure analysis of the metal wirings is the key to ensure the reliability of signal transmission when the pad be bent to the back of the panel. In the pre...

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Bibliographic Details
Main Authors: Di Wu, Yongzhen Jia, Dunming Liao, Bo Zhang, Chen Liu, Ning Wang, Wenjing Peng, Liting Huang
Format: Article
Language:English
Published: Taylor & Francis Group 2023-04-01
Series:Journal of Information Display
Subjects:
Narrow bezel
AMOLED panel
pad bending
mechanical simulation
Online Access:https://www.tandfonline.com/doi/10.1080/15980316.2022.2139301

Internet

https://www.tandfonline.com/doi/10.1080/15980316.2022.2139301

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