Mechanical simulation for the bending process of the AMOLED panel pad
Panel pad bending is a critical process to improve the screen-to-body ratio of an active-matrix organic light-emitting diode (AMOLED) panel. The failure analysis of the metal wirings is the key to ensure the reliability of signal transmission when the pad be bent to the back of the panel. In the pre...
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2023-04-01
|
| Series: | Journal of Information Display |
| Subjects: | |
| Online Access: | https://www.tandfonline.com/doi/10.1080/15980316.2022.2139301 |
| _version_ | 1797829865378938880 |
|---|---|
| author | Di Wu Yongzhen Jia Dunming Liao Bo Zhang Chen Liu Ning Wang Wenjing Peng Liting Huang |
| author_facet | Di Wu Yongzhen Jia Dunming Liao Bo Zhang Chen Liu Ning Wang Wenjing Peng Liting Huang |
| author_sort | Di Wu |
| collection | DOAJ |
| description | Panel pad bending is a critical process to improve the screen-to-body ratio of an active-matrix organic light-emitting diode (AMOLED) panel. The failure analysis of the metal wirings is the key to ensure the reliability of signal transmission when the pad be bent to the back of the panel. In the present work, the sub-modeling technique combined with the periodic boundary condition was used to simulate the stress distribution of the bending area of the pad. The progressive failure of bent metal wirings was investigated by the extended finite element method. It is proved to be rational to prevent the wirings damage if the interlayer dielectric is replaced by an organic layer. In order to reduce stress of metal wirings, it is a measure to replace the original ultraviolet (UV) curable adhesive with a higher-modulus UV adhesive. The simulated results also show that rectangular perforations can avoid the stress concentration caused by the holes compared with circular perforations. For better stress distribution of metal wirings, it is necessary to increase the lengths of the rectangular holes and decrease the widths of that to a certain extent, which is helpful for restraining crack propagation by means of low-stress zones and holes. |
| first_indexed | 2024-04-09T13:28:04Z |
| format | Article |
| id | doaj.art-f759751a6971406286f4833df945ffd9 |
| institution | Directory Open Access Journal |
| issn | 1598-0316 2158-1606 |
| language | English |
| last_indexed | 2024-04-09T13:28:04Z |
| publishDate | 2023-04-01 |
| publisher | Taylor & Francis Group |
| record_format | Article |
| series | Journal of Information Display |
| spelling | doaj.art-f759751a6971406286f4833df945ffd92023-05-10T07:37:33ZengTaylor & Francis GroupJournal of Information Display1598-03162158-16062023-04-012429310210.1080/15980316.2022.2139301Mechanical simulation for the bending process of the AMOLED panel padDi Wu0Yongzhen Jia1Dunming Liao2Bo Zhang3Chen Liu4Ning Wang5Wenjing Peng6Liting Huang7State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, People’s Republic of ChinaTCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, People’s Republic of ChinaState Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, People’s Republic of ChinaState Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, People’s Republic of ChinaState Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, People’s Republic of ChinaWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, People’s Republic of ChinaState Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, People’s Republic of ChinaState Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, People’s Republic of ChinaPanel pad bending is a critical process to improve the screen-to-body ratio of an active-matrix organic light-emitting diode (AMOLED) panel. The failure analysis of the metal wirings is the key to ensure the reliability of signal transmission when the pad be bent to the back of the panel. In the present work, the sub-modeling technique combined with the periodic boundary condition was used to simulate the stress distribution of the bending area of the pad. The progressive failure of bent metal wirings was investigated by the extended finite element method. It is proved to be rational to prevent the wirings damage if the interlayer dielectric is replaced by an organic layer. In order to reduce stress of metal wirings, it is a measure to replace the original ultraviolet (UV) curable adhesive with a higher-modulus UV adhesive. The simulated results also show that rectangular perforations can avoid the stress concentration caused by the holes compared with circular perforations. For better stress distribution of metal wirings, it is necessary to increase the lengths of the rectangular holes and decrease the widths of that to a certain extent, which is helpful for restraining crack propagation by means of low-stress zones and holes.https://www.tandfonline.com/doi/10.1080/15980316.2022.2139301Narrow bezelAMOLED panelpad bendingmechanical simulation |
| spellingShingle | Di Wu Yongzhen Jia Dunming Liao Bo Zhang Chen Liu Ning Wang Wenjing Peng Liting Huang Mechanical simulation for the bending process of the AMOLED panel pad Journal of Information Display Narrow bezel AMOLED panel pad bending mechanical simulation |
| title | Mechanical simulation for the bending process of the AMOLED panel pad |
| title_full | Mechanical simulation for the bending process of the AMOLED panel pad |
| title_fullStr | Mechanical simulation for the bending process of the AMOLED panel pad |
| title_full_unstemmed | Mechanical simulation for the bending process of the AMOLED panel pad |
| title_short | Mechanical simulation for the bending process of the AMOLED panel pad |
| title_sort | mechanical simulation for the bending process of the amoled panel pad |
| topic | Narrow bezel AMOLED panel pad bending mechanical simulation |
| url | https://www.tandfonline.com/doi/10.1080/15980316.2022.2139301 |
| work_keys_str_mv | AT diwu mechanicalsimulationforthebendingprocessoftheamoledpanelpad AT yongzhenjia mechanicalsimulationforthebendingprocessoftheamoledpanelpad AT dunmingliao mechanicalsimulationforthebendingprocessoftheamoledpanelpad AT bozhang mechanicalsimulationforthebendingprocessoftheamoledpanelpad AT chenliu mechanicalsimulationforthebendingprocessoftheamoledpanelpad AT ningwang mechanicalsimulationforthebendingprocessoftheamoledpanelpad AT wenjingpeng mechanicalsimulationforthebendingprocessoftheamoledpanelpad AT litinghuang mechanicalsimulationforthebendingprocessoftheamoledpanelpad |