Mechanical simulation for the bending process of the AMOLED panel pad
Panel pad bending is a critical process to improve the screen-to-body ratio of an active-matrix organic light-emitting diode (AMOLED) panel. The failure analysis of the metal wirings is the key to ensure the reliability of signal transmission when the pad be bent to the back of the panel. In the pre...
Main Authors: | Di Wu, Yongzhen Jia, Dunming Liao, Bo Zhang, Chen Liu, Ning Wang, Wenjing Peng, Liting Huang |
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Format: | Article |
Language: | English |
Published: |
Taylor & Francis Group
2023-04-01
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Series: | Journal of Information Display |
Subjects: | |
Online Access: | https://www.tandfonline.com/doi/10.1080/15980316.2022.2139301 |
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