Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder
The CoCuFeNi high entropy alloy (HEA) has excellent electrical, thermal, and mechanical properties. In electronic packaging technology, Sn is the major element of lead-free solders. In this study, we used the CoCuFeNi HEA as the substrate and Sn as the solder and investigated the liquid/solid interf...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-04-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/13/4/710 |