Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder
The CoCuFeNi high entropy alloy (HEA) has excellent electrical, thermal, and mechanical properties. In electronic packaging technology, Sn is the major element of lead-free solders. In this study, we used the CoCuFeNi HEA as the substrate and Sn as the solder and investigated the liquid/solid interf...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-04-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/13/4/710 |
| _version_ | 1797604349699948544 |
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| author | Tzu-Yang Chiang Yong-Chi Chang Chao-Hong Wang Andromeda Dwi Laksono Yee-Wen Yen |
| author_facet | Tzu-Yang Chiang Yong-Chi Chang Chao-Hong Wang Andromeda Dwi Laksono Yee-Wen Yen |
| author_sort | Tzu-Yang Chiang |
| collection | DOAJ |
| description | The CoCuFeNi high entropy alloy (HEA) has excellent electrical, thermal, and mechanical properties. In electronic packaging technology, Sn is the major element of lead-free solders. In this study, we used the CoCuFeNi HEA as the substrate and Sn as the solder and investigated the liquid/solid interfacial reactions of the Sn/CoCuFeNi system at 300, 375, and 450 °C for 30, 60, 100, 150, 360, and 480 min. The results indicated that the (Fe, Co)Sn<sub>2</sub> phase was formed in the Sn/CoCuFeNi couples for all various reaction temperatures and at different durations. Additionally, the (Co, Ni)Sn<sub>2</sub> phase was precipitated at the solder side and near the (Fe, Co)Sn<sub>2</sub> phase when the reaction time increased. The thickness of the (Fe, Co)Sn<sub>2</sub> phase increased with the increase in reaction temperature and time, and it was proportional to the square root of the reaction time. Overall, our results showed that the growth mechanism of the (Fe, Co)Sn<sub>2</sub> phase was diffusion-controlled in the Sn/CoCuFeNi couples. |
| first_indexed | 2024-03-11T04:45:14Z |
| format | Article |
| id | doaj.art-f76df933e9604e64b32358cc7bc0673d |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-11T04:45:14Z |
| publishDate | 2023-04-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj.art-f76df933e9604e64b32358cc7bc0673d2023-11-17T20:26:37ZengMDPI AGMetals2075-47012023-04-0113471010.3390/met13040710Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn SolderTzu-Yang Chiang0Yong-Chi Chang1Chao-Hong Wang2Andromeda Dwi Laksono3Yee-Wen Yen4Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10672, TaiwanDepartment of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10672, TaiwanDepartment of Chemical Engineering, National Chung Cheng University, Chiayi 621301, TaiwanDepartment of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10672, TaiwanDepartment of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10672, TaiwanThe CoCuFeNi high entropy alloy (HEA) has excellent electrical, thermal, and mechanical properties. In electronic packaging technology, Sn is the major element of lead-free solders. In this study, we used the CoCuFeNi HEA as the substrate and Sn as the solder and investigated the liquid/solid interfacial reactions of the Sn/CoCuFeNi system at 300, 375, and 450 °C for 30, 60, 100, 150, 360, and 480 min. The results indicated that the (Fe, Co)Sn<sub>2</sub> phase was formed in the Sn/CoCuFeNi couples for all various reaction temperatures and at different durations. Additionally, the (Co, Ni)Sn<sub>2</sub> phase was precipitated at the solder side and near the (Fe, Co)Sn<sub>2</sub> phase when the reaction time increased. The thickness of the (Fe, Co)Sn<sub>2</sub> phase increased with the increase in reaction temperature and time, and it was proportional to the square root of the reaction time. Overall, our results showed that the growth mechanism of the (Fe, Co)Sn<sub>2</sub> phase was diffusion-controlled in the Sn/CoCuFeNi couples.https://www.mdpi.com/2075-4701/13/4/710CoCuFeNi high entropy alloylead-free solderSn/CoCuFeNi coupleliquid/solid interfacial reactiondiffusion-controlled |
| spellingShingle | Tzu-Yang Chiang Yong-Chi Chang Chao-Hong Wang Andromeda Dwi Laksono Yee-Wen Yen Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder Metals CoCuFeNi high entropy alloy lead-free solder Sn/CoCuFeNi couple liquid/solid interfacial reaction diffusion-controlled |
| title | Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder |
| title_full | Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder |
| title_fullStr | Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder |
| title_full_unstemmed | Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder |
| title_short | Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder |
| title_sort | investigation of the interfacial reactions between the cocufeni high entropy alloy and sn solder |
| topic | CoCuFeNi high entropy alloy lead-free solder Sn/CoCuFeNi couple liquid/solid interfacial reaction diffusion-controlled |
| url | https://www.mdpi.com/2075-4701/13/4/710 |
| work_keys_str_mv | AT tzuyangchiang investigationoftheinterfacialreactionsbetweenthecocufenihighentropyalloyandsnsolder AT yongchichang investigationoftheinterfacialreactionsbetweenthecocufenihighentropyalloyandsnsolder AT chaohongwang investigationoftheinterfacialreactionsbetweenthecocufenihighentropyalloyandsnsolder AT andromedadwilaksono investigationoftheinterfacialreactionsbetweenthecocufenihighentropyalloyandsnsolder AT yeewenyen investigationoftheinterfacialreactionsbetweenthecocufenihighentropyalloyandsnsolder |