Thermal property evaluation of a 2.5D integration method with device level microchannel direct cooling for a high-power GaN HEMT device

Bibliographic Details
Main Authors:	Tingting Lian, Yanming Xia, Zhizheng Wang, Xiaofeng Yang, Zhiwei Fu, Xin Kong, Shuxun Lin, Shenglin Ma
Format:	Article
Language:	English
Published:	Nature Publishing Group 2022-11-01
Series:	Microsystems & Nanoengineering
Online Access:	https://doi.org/10.1038/s41378-022-00462-3

Internet