Functionalized Three-Dimensional Multilayer Ceramic Modules
Three-dimensional interconnect devices are still strongly related to plastic materials. Since the use of these materials is limited in harsh environments, there is an application gap, which could be filled by ceramic circuit carriers. Low-temperature cofired ceramics (LTCC) offer promising solutions...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-01-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/10/3/248 |