Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions
Solder joints of ball grid arrays (BGA) have been widely used to connect electronic components to printed circuit boards (PCBs) and are often subjected to mechanical stress. Several studies have been conducted on the mechanical reliability of solder joints. While these studies have been useful in th...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-11-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/13/22/12137 |