Physical properties of some unfilled resins employed in semiconductor packages
We have performed thermo-mechanical and electrical tests on epoxy resin samples used for semiconductor packaging applications. The reported resins are commonly used in Texas Instrument Incorporated products. The study was performed to better understand the influence of the resin system on physical p...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2018-01-01
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| Series: | Cogent Engineering |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1080/23311916.2018.1441586 |