Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
Very thin multi-layers of Cu and epoxy compound in PCB (printed circuit board) make difficult to design computational meshes in finite element method simulation programs. Number of degrees of freedom in simulated system rapidly increases - it significantly extends simulation computational time. In t...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
University of Žilina
2018-03-01
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| Series: | Communications |
| Subjects: | |
| Online Access: | https://komunikacie.uniza.sk/artkey/csl-201801-0013_optimized-thermal-simulation-model-of-multilayer-printed-circuit-board.php |