Optimized Thermal Simulation Model of Multilayer Printed Circuit Board

Very thin multi-layers of Cu and epoxy compound in PCB (printed circuit board) make difficult to design computational meshes in finite element method simulation programs. Number of degrees of freedom in simulated system rapidly increases - it significantly extends simulation computational time. In t...

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Main Authors: Michal Frivaldsky, Pavol Spanik, Jan Morgos, Norbert Glapa
Format: Article
Language:English
Published: University of Žilina 2018-03-01
Series:Communications
Subjects:
Online Access:https://komunikacie.uniza.sk/artkey/csl-201801-0013_optimized-thermal-simulation-model-of-multilayer-printed-circuit-board.php
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author Michal Frivaldsky
Pavol Spanik
Jan Morgos
Norbert Glapa
author_facet Michal Frivaldsky
Pavol Spanik
Jan Morgos
Norbert Glapa
author_sort Michal Frivaldsky
collection DOAJ
description Very thin multi-layers of Cu and epoxy compound in PCB (printed circuit board) make difficult to design computational meshes in finite element method simulation programs. Number of degrees of freedom in simulated system rapidly increases - it significantly extends simulation computational time. In this paper we propose substitution of the PCB in axial and radial direction with the composite structure with equivalent physical parameters of multilayer PCB.
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spelling doaj.art-f885e483f1ed4aa78ddea275536a65bb2023-04-14T06:31:44ZengUniversity of ŽilinaCommunications1335-42052585-78782018-03-01201788110.26552/com.C.2018.1.78-81csl-201801-0013Optimized Thermal Simulation Model of Multilayer Printed Circuit BoardMichal Frivaldsky0Pavol Spanik1Jan Morgos2Norbert Glapa3Department of Mechatronics and Electronics, Faculty of Electrical Engineering, University of Zilina, SlovakiaDepartment of Mechatronics and Electronics, Faculty of Electrical Engineering, University of Zilina, SlovakiaDepartment of Mechatronics and Electronics, Faculty of Electrical Engineering, University of Zilina, SlovakiaPanasonic Industrial Devices, GmbH, Luneburg, GermanyVery thin multi-layers of Cu and epoxy compound in PCB (printed circuit board) make difficult to design computational meshes in finite element method simulation programs. Number of degrees of freedom in simulated system rapidly increases - it significantly extends simulation computational time. In this paper we propose substitution of the PCB in axial and radial direction with the composite structure with equivalent physical parameters of multilayer PCB.https://komunikacie.uniza.sk/artkey/csl-201801-0013_optimized-thermal-simulation-model-of-multilayer-printed-circuit-board.phpmultilayer printed circuit boardthermal modelingapproximationsimulation
spellingShingle Michal Frivaldsky
Pavol Spanik
Jan Morgos
Norbert Glapa
Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
Communications
multilayer printed circuit board
thermal modeling
approximation
simulation
title Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
title_full Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
title_fullStr Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
title_full_unstemmed Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
title_short Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
title_sort optimized thermal simulation model of multilayer printed circuit board
topic multilayer printed circuit board
thermal modeling
approximation
simulation
url https://komunikacie.uniza.sk/artkey/csl-201801-0013_optimized-thermal-simulation-model-of-multilayer-printed-circuit-board.php
work_keys_str_mv AT michalfrivaldsky optimizedthermalsimulationmodelofmultilayerprintedcircuitboard
AT pavolspanik optimizedthermalsimulationmodelofmultilayerprintedcircuitboard
AT janmorgos optimizedthermalsimulationmodelofmultilayerprintedcircuitboard
AT norbertglapa optimizedthermalsimulationmodelofmultilayerprintedcircuitboard