Optimized Thermal Simulation Model of Multilayer Printed Circuit Board
Very thin multi-layers of Cu and epoxy compound in PCB (printed circuit board) make difficult to design computational meshes in finite element method simulation programs. Number of degrees of freedom in simulated system rapidly increases - it significantly extends simulation computational time. In t...
Main Authors: | , , , |
---|---|
Format: | Article |
Language: | English |
Published: |
University of Žilina
2018-03-01
|
Series: | Communications |
Subjects: | |
Online Access: | https://komunikacie.uniza.sk/artkey/csl-201801-0013_optimized-thermal-simulation-model-of-multilayer-printed-circuit-board.php |
_version_ | 1797846863503687680 |
---|---|
author | Michal Frivaldsky Pavol Spanik Jan Morgos Norbert Glapa |
author_facet | Michal Frivaldsky Pavol Spanik Jan Morgos Norbert Glapa |
author_sort | Michal Frivaldsky |
collection | DOAJ |
description | Very thin multi-layers of Cu and epoxy compound in PCB (printed circuit board) make difficult to design computational meshes in finite element method simulation programs. Number of degrees of freedom in simulated system rapidly increases - it significantly extends simulation computational time. In this paper we propose substitution of the PCB in axial and radial direction with the composite structure with equivalent physical parameters of multilayer PCB. |
first_indexed | 2024-04-09T18:01:50Z |
format | Article |
id | doaj.art-f885e483f1ed4aa78ddea275536a65bb |
institution | Directory Open Access Journal |
issn | 1335-4205 2585-7878 |
language | English |
last_indexed | 2024-04-09T18:01:50Z |
publishDate | 2018-03-01 |
publisher | University of Žilina |
record_format | Article |
series | Communications |
spelling | doaj.art-f885e483f1ed4aa78ddea275536a65bb2023-04-14T06:31:44ZengUniversity of ŽilinaCommunications1335-42052585-78782018-03-01201788110.26552/com.C.2018.1.78-81csl-201801-0013Optimized Thermal Simulation Model of Multilayer Printed Circuit BoardMichal Frivaldsky0Pavol Spanik1Jan Morgos2Norbert Glapa3Department of Mechatronics and Electronics, Faculty of Electrical Engineering, University of Zilina, SlovakiaDepartment of Mechatronics and Electronics, Faculty of Electrical Engineering, University of Zilina, SlovakiaDepartment of Mechatronics and Electronics, Faculty of Electrical Engineering, University of Zilina, SlovakiaPanasonic Industrial Devices, GmbH, Luneburg, GermanyVery thin multi-layers of Cu and epoxy compound in PCB (printed circuit board) make difficult to design computational meshes in finite element method simulation programs. Number of degrees of freedom in simulated system rapidly increases - it significantly extends simulation computational time. In this paper we propose substitution of the PCB in axial and radial direction with the composite structure with equivalent physical parameters of multilayer PCB.https://komunikacie.uniza.sk/artkey/csl-201801-0013_optimized-thermal-simulation-model-of-multilayer-printed-circuit-board.phpmultilayer printed circuit boardthermal modelingapproximationsimulation |
spellingShingle | Michal Frivaldsky Pavol Spanik Jan Morgos Norbert Glapa Optimized Thermal Simulation Model of Multilayer Printed Circuit Board Communications multilayer printed circuit board thermal modeling approximation simulation |
title | Optimized Thermal Simulation Model of Multilayer Printed Circuit Board |
title_full | Optimized Thermal Simulation Model of Multilayer Printed Circuit Board |
title_fullStr | Optimized Thermal Simulation Model of Multilayer Printed Circuit Board |
title_full_unstemmed | Optimized Thermal Simulation Model of Multilayer Printed Circuit Board |
title_short | Optimized Thermal Simulation Model of Multilayer Printed Circuit Board |
title_sort | optimized thermal simulation model of multilayer printed circuit board |
topic | multilayer printed circuit board thermal modeling approximation simulation |
url | https://komunikacie.uniza.sk/artkey/csl-201801-0013_optimized-thermal-simulation-model-of-multilayer-printed-circuit-board.php |
work_keys_str_mv | AT michalfrivaldsky optimizedthermalsimulationmodelofmultilayerprintedcircuitboard AT pavolspanik optimizedthermalsimulationmodelofmultilayerprintedcircuitboard AT janmorgos optimizedthermalsimulationmodelofmultilayerprintedcircuitboard AT norbertglapa optimizedthermalsimulationmodelofmultilayerprintedcircuitboard |