Influence of Quality of Mounting Process of RF Transistors on Their Thermal Parameters and Lifetime
The paper presents the results of investigations illustrating the influence of imperfections in the soldering process on thermal properties of transistors operating in RF (Radio Frequency) systems. The methods of measurements used to determine the junction and case temperature of the tested transist...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-06-01
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| Series: | Applied Sciences |
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| Online Access: | https://www.mdpi.com/2076-3417/12/12/6113 |
| _version_ | 1827662662974046208 |
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| author | Krzysztof Górecki Wojciech Kowalke Przemysław Ptak |
| author_facet | Krzysztof Górecki Wojciech Kowalke Przemysław Ptak |
| author_sort | Krzysztof Górecki |
| collection | DOAJ |
| description | The paper presents the results of investigations illustrating the influence of imperfections in the soldering process on thermal properties of transistors operating in RF (Radio Frequency) systems. The methods of measurements used to determine the junction and case temperature of the tested transistors and their thermal resistance are described. The results of the performed measurements are presented and discussed, and their statistical analysis is carried out. The correlation between thermal parameters of the tested transistors, parameters of the assembly process and the measurement conditions is investigated. Some calculation results illustrating an influence of device thermal resistance and dissipated power on changing its lifetime are shown and discussed. It is also shown that no correlation between the void sizes and the device thermal resistance and lifetime is observed. Possibilities of improving the assembly process are indicated, which allows extending the expected lifetime of the tested transistors. |
| first_indexed | 2024-03-10T00:30:08Z |
| format | Article |
| id | doaj.art-f96b94393f704f4b8c964ea7e4c84a9c |
| institution | Directory Open Access Journal |
| issn | 2076-3417 |
| language | English |
| last_indexed | 2024-03-10T00:30:08Z |
| publishDate | 2022-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Applied Sciences |
| spelling | doaj.art-f96b94393f704f4b8c964ea7e4c84a9c2023-11-23T15:28:01ZengMDPI AGApplied Sciences2076-34172022-06-011212611310.3390/app12126113Influence of Quality of Mounting Process of RF Transistors on Their Thermal Parameters and LifetimeKrzysztof Górecki0Wojciech Kowalke1Przemysław Ptak2Department of Marine Electronics, Faculty of Electrical Engineering, Gdynia Maritime University, Morska 81-87, 81-225 Gdynia, PolandFlex, 83-100 Tczew, PolandDepartment of Marine Electronics, Faculty of Electrical Engineering, Gdynia Maritime University, Morska 81-87, 81-225 Gdynia, PolandThe paper presents the results of investigations illustrating the influence of imperfections in the soldering process on thermal properties of transistors operating in RF (Radio Frequency) systems. The methods of measurements used to determine the junction and case temperature of the tested transistors and their thermal resistance are described. The results of the performed measurements are presented and discussed, and their statistical analysis is carried out. The correlation between thermal parameters of the tested transistors, parameters of the assembly process and the measurement conditions is investigated. Some calculation results illustrating an influence of device thermal resistance and dissipated power on changing its lifetime are shown and discussed. It is also shown that no correlation between the void sizes and the device thermal resistance and lifetime is observed. Possibilities of improving the assembly process are indicated, which allows extending the expected lifetime of the tested transistors.https://www.mdpi.com/2076-3417/12/12/6113RF networksassembly processthermal parametersmeasurementslifetime |
| spellingShingle | Krzysztof Górecki Wojciech Kowalke Przemysław Ptak Influence of Quality of Mounting Process of RF Transistors on Their Thermal Parameters and Lifetime Applied Sciences RF networks assembly process thermal parameters measurements lifetime |
| title | Influence of Quality of Mounting Process of RF Transistors on Their Thermal Parameters and Lifetime |
| title_full | Influence of Quality of Mounting Process of RF Transistors on Their Thermal Parameters and Lifetime |
| title_fullStr | Influence of Quality of Mounting Process of RF Transistors on Their Thermal Parameters and Lifetime |
| title_full_unstemmed | Influence of Quality of Mounting Process of RF Transistors on Their Thermal Parameters and Lifetime |
| title_short | Influence of Quality of Mounting Process of RF Transistors on Their Thermal Parameters and Lifetime |
| title_sort | influence of quality of mounting process of rf transistors on their thermal parameters and lifetime |
| topic | RF networks assembly process thermal parameters measurements lifetime |
| url | https://www.mdpi.com/2076-3417/12/12/6113 |
| work_keys_str_mv | AT krzysztofgorecki influenceofqualityofmountingprocessofrftransistorsontheirthermalparametersandlifetime AT wojciechkowalke influenceofqualityofmountingprocessofrftransistorsontheirthermalparametersandlifetime AT przemysławptak influenceofqualityofmountingprocessofrftransistorsontheirthermalparametersandlifetime |