Effect of thermal modification on the stress relaxation behavior and microstructure of the cell wall
Abstract The stress relaxation behavior and cell wall microstructure of sugi were evaluated after thermal modification. Stress relaxation is observed and has a broad relaxation spectrum, implying various relaxation mechanisms. The relaxation was analyzed using a stretched exponential function, namel...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2023-08-01
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| Series: | Journal of Wood Science |
| Subjects: | |
| Online Access: | https://doi.org/10.1186/s10086-023-02098-x |