A Broadband Inline Transition From On-PCB Microstrip to Hybrid Stack-Up Integrated Additively Fabricated Air-Filled Waveguide

A Broadband Inline Transition From On-PCB Microstrip to Hybrid Stack-Up Integrated Additively Fabricated Air-Filled Waveguide

A novel type of a highly integrated low-loss stack-up is explored that leverages additive manufacturing for the integration of a 3D printed and metal-coated air-filled waveguide with a Printed Circuit Board (PCB) by sharing a common ground plane. A complementing microstrip to waveguide transition is...

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Détails bibliographiques
Auteurs principaux: Jakub Sorocki, Ilona Piekarz, Nicolo Delmonte, Lorenzo Silvestri, Maurizio Bozzi
Format: Article
Langue:English
Publié: IEEE 2024-01-01
Collection:IEEE Access
Sujets:
3D printing
additive manufacturing
broadband transition
metal coating
microwave
waveguide
Accès en ligne:https://ieeexplore.ieee.org/document/10388325/

Internet

https://ieeexplore.ieee.org/document/10388325/

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