Contribution of grain boundary to strength and electrical conductivity of annealed copper wires
The effect of grain boundaries on the strength and electrical conductivity of annealed copper wires was studied. After annealing at 100 °C for 30 min, the copper wires retained a fiber-like structure. The increase in electrical conductivity is believed to stem from the decrease of crystallographic d...
| Principais autores: | , , , , , , |
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| Formato: | Artigo |
| Idioma: | English |
| Publicado em: |
Elsevier
2023-09-01
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| coleção: | Journal of Materials Research and Technology |
| Assuntos: | |
| Acesso em linha: | http://www.sciencedirect.com/science/article/pii/S2238785423018239 |