Guest Editorial: Nanopackaging Part II
The papers in this special section focus on nanopackaging. It begins with three reviews of diverse nanoscale technologies and then moves on to research papers focused primarily on nanomaterials for on-chip interconnect and noise abatement.
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2022-01-01
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| Series: | IEEE Open Journal of Nanotechnology |
| Online Access: | https://ieeexplore.ieee.org/document/9997810/ |