Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock

Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock

Aiming for a suitable die-attached substrate for Ag-sintered joint technology during harsh operating environment, three surface finishes of sputtered Ti/Ag- layers, electroless Ni-/Pt-/Ag- layers, and electroplated Ni-/electroless Ni-/Pt-/Ag- layers were developed to directly bond copper (DBC) subst...

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Bibliographic Details
Main Authors: Yang Liu, Chuantong Chen, Zheng Zhang, Minoru Ueshima, Takeshi Sakamoto, Takuya Naoe, Hiroshi Nishikawa, Yukinori Oda, Katsuaki Suganuma
Format: Article
Language:English
Published: Elsevier 2022-12-01
Series:Materials & Design
Subjects:
Ag-sinter joint
Coating technology
Thermal shock test
Deformation-resistant
Interface evolution
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127522010115

Internet

http://www.sciencedirect.com/science/article/pii/S0264127522010115

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