Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock
Aiming for a suitable die-attached substrate for Ag-sintered joint technology during harsh operating environment, three surface finishes of sputtered Ti/Ag- layers, electroless Ni-/Pt-/Ag- layers, and electroplated Ni-/electroless Ni-/Pt-/Ag- layers were developed to directly bond copper (DBC) subst...
Main Authors: | Yang Liu, Chuantong Chen, Zheng Zhang, Minoru Ueshima, Takeshi Sakamoto, Takuya Naoe, Hiroshi Nishikawa, Yukinori Oda, Katsuaki Suganuma |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2022-12-01
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Series: | Materials & Design |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127522010115 |
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