Buckle Driven Delamination in Thin Hard Film Compliant Substrate Systems

Buckle Driven Delamination in Thin Hard Film Compliant Substrate Systems

Deformation and fracture of thin films on compliant substrates are key factors constraining the performance of emerging flexible substrate devices. [1-3] These systems often contain layers of thin polymer, ceramic and metallic films and stretchable interconnects where differing properties induce...

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Bibliographic Details
Main Authors:	Bahr D.F., Cordill M.J., Kennedy M.S., Adams D.P., Reedy E.D., Corona E., Moody N. R.
Format:	Article
Language:	English
Published:	EDP Sciences 2010-06-01
Series:	EPJ Web of Conferences
Online Access:	http://dx.doi.org/10.1051/epjconf/20100640006

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