The Mechanical Properties and Elastic Anisotropy of η′-Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn Intermetallic Compounds

Full intermetallic compound (IMC) solder joints present fascinating advantages in high-temperature applications. In this study, the mechanical properties and elastic anisotropy of η′-Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn intermetallic compounds were in...

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Bibliographic Details
Main Authors: Chao Ding, Jian Wang, Tianhan Liu, Hongbo Qin, Daoguo Yang, Guoqi Zhang
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Crystals
Subjects:
Online Access:https://www.mdpi.com/2073-4352/11/12/1562