Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics
Heat sinks are commonly used for the dissipation of heat in microelectronics packages. The choice of optimal heat sinks configuration largely depends on the market demand and thermal performance. Hence, having the right heat sinks configuration is vital to the overall thermal durability of the mic...
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| Format: | Article |
| Language: | English |
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Joint Coordination Centre of the World Bank assisted National Agricultural Research Programme (NARP)
2020-01-01
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| Series: | Journal of Applied Sciences and Environmental Management |
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| Online Access: | https://www.ajol.info/index.php/jasem/article/view/192501 |