Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics
Heat sinks are commonly used for the dissipation of heat in microelectronics packages. The choice of optimal heat sinks configuration largely depends on the market demand and thermal performance. Hence, having the right heat sinks configuration is vital to the overall thermal durability of the mic...
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| Format: | Article |
| Language: | English |
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Joint Coordination Centre of the World Bank assisted National Agricultural Research Programme (NARP)
2020-01-01
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| Series: | Journal of Applied Sciences and Environmental Management |
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| Online Access: | https://www.ajol.info/index.php/jasem/article/view/192501 |
| _version_ | 1797228071673135104 |
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| author | M Ekpu |
| author_facet | M Ekpu |
| author_sort | M Ekpu |
| collection | DOAJ |
| description |
Heat sinks are commonly used for the dissipation of heat in microelectronics packages. The choice of optimal heat sinks configuration largely depends on the market demand and thermal performance. Hence, having the right heat sinks configuration is vital to the overall thermal durability of the microelectronics package. This paper investigates the thermal resistance and efficiency of heat sink fins geometry in microelectronics application. This study investigates the shapes of six (square, rectangular, triangular, hexagonal, circular, and elliptical) different heat sink fins on thermal performance. ANSYS finite element design software was used to create the 3D models and meshed between 5-20% of the initial mesh size. Transient thermal conduction analysis was used in analysing the heat sinks. The results obtained demonstrated that the more number of elements in the mesh (or the finer the mesh) the better the convergence of the numerical solution. The results also showed that the rectangular shaped heat sink fins exhibited better thermal capabilities than the other shaped fins, by having a maximum temperature of about 42.5oC, thermal resistance of about 0.244 K/W, and thermal efficiency of about 50%.
Keywords: heat sink; fin geometry; thermal resistance
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| first_indexed | 2024-04-24T14:50:52Z |
| format | Article |
| id | doaj.art-fc3d3a914a7a493993111b743020cc0e |
| institution | Directory Open Access Journal |
| issn | 2659-1502 2659-1499 |
| language | English |
| last_indexed | 2024-04-24T14:50:52Z |
| publishDate | 2020-01-01 |
| publisher | Joint Coordination Centre of the World Bank assisted National Agricultural Research Programme (NARP) |
| record_format | Article |
| series | Journal of Applied Sciences and Environmental Management |
| spelling | doaj.art-fc3d3a914a7a493993111b743020cc0e2024-04-02T19:49:56ZengJoint Coordination Centre of the World Bank assisted National Agricultural Research Programme (NARP)Journal of Applied Sciences and Environmental Management2659-15022659-14992020-01-01231110.4314/jasem.v23i11.24Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronicsM Ekpu Heat sinks are commonly used for the dissipation of heat in microelectronics packages. The choice of optimal heat sinks configuration largely depends on the market demand and thermal performance. Hence, having the right heat sinks configuration is vital to the overall thermal durability of the microelectronics package. This paper investigates the thermal resistance and efficiency of heat sink fins geometry in microelectronics application. This study investigates the shapes of six (square, rectangular, triangular, hexagonal, circular, and elliptical) different heat sink fins on thermal performance. ANSYS finite element design software was used to create the 3D models and meshed between 5-20% of the initial mesh size. Transient thermal conduction analysis was used in analysing the heat sinks. The results obtained demonstrated that the more number of elements in the mesh (or the finer the mesh) the better the convergence of the numerical solution. The results also showed that the rectangular shaped heat sink fins exhibited better thermal capabilities than the other shaped fins, by having a maximum temperature of about 42.5oC, thermal resistance of about 0.244 K/W, and thermal efficiency of about 50%. Keywords: heat sink; fin geometry; thermal resistance https://www.ajol.info/index.php/jasem/article/view/192501heat sinkfin geometrythermal resistance |
| spellingShingle | M Ekpu Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics Journal of Applied Sciences and Environmental Management heat sink fin geometry thermal resistance |
| title | Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics |
| title_full | Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics |
| title_fullStr | Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics |
| title_full_unstemmed | Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics |
| title_short | Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics |
| title_sort | finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics |
| topic | heat sink fin geometry thermal resistance |
| url | https://www.ajol.info/index.php/jasem/article/view/192501 |
| work_keys_str_mv | AT mekpu finiteelementanalysisoftheeffectoffingeometryonthermalperformanceofheatsinksinmicroelectronics |