Open‐circuit submodule fault diagnosis in MMCs using support vector machines

Abstract Series connection of semiconductor submodules (SM) in a modular multilevel converter (MMC) makes the MMC prone to open‐circuit (OC) IGBT failures inside SMs. If left undetected, these faults degrade the operation of the MMC and lead to its instability. This article proposes a method to dete...

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Bibliographic Details
Main Authors: Ardavan Mohammadhassani, Ali Mehrizi‐Sani
Format: Article
Language:English
Published: Wiley 2022-12-01
Series:IET Generation, Transmission & Distribution
Online Access:https://doi.org/10.1049/gtd2.12652
Description
Summary:Abstract Series connection of semiconductor submodules (SM) in a modular multilevel converter (MMC) makes the MMC prone to open‐circuit (OC) IGBT failures inside SMs. If left undetected, these faults degrade the operation of the MMC and lead to its instability. This article proposes a method to detect, localise, and classify single OC SM faults in an MMC using support vector machines (SVM) trained with data obtained from the capacitor voltage balancing block of the MMC control system. The proposed method relies on data extracted from the sorted capacitor voltage arrays of the upper and lower phase arms. Therefore, it does not require extra measurements and hardware. Additionally, it offers a fixed time for detecting and localising OC SM faults. This method is easy to implement as SVM has a simple decision function. Time‐domain simulation case studies are performed on a three‐phase nine‐level MMC to evaluate the performance of the proposed method.
ISSN:1751-8687
1751-8695