Interface Optimization and Thermal Conductivity of Cu/Diamond Composites by Spark Plasma Sintering Process
Cu/Diamond (Cu/Dia) composites are regarded as next-generation thermal dissipation materials and hold tremendous potential for use in future high-power electronic devices. The interface structure between the Cu matrix and the diamond has a significant impact on the thermophysical properties of the c...
| Main Authors: | , , , , , |
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| 格式: | Article |
| 語言: | English |
| 出版: |
MDPI AG
2025-01-01
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| 叢編: | Nanomaterials |
| 主題: | |
| 在線閱讀: | https://www.mdpi.com/2079-4991/15/1/73 |