Inspection and Classification of Semiconductor Wafer Surface Defects Using CNN Deep Learning Networks
Due to advances in semiconductor processing technologies, each slice of a semiconductor is becoming denser and more complex, which can increase the number of surface defects. These defects should be caught early and correctly classified in order help identify the causes of these defects in the proce...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-08-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/10/15/5340 |