Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer
This study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this paper, the effects of adhesion (or lubrication) betw...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Japanese Society of Tribologists
2008-10-01
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| Series: | Tribology Online |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/trol/3/5/3_5_248/_pdf/-char/en |
| _version_ | 1818824109495156736 |
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| author | Jun Shimizu Hiroshi Eda Libo Zhou Hidemitsu Okabe |
| author_facet | Jun Shimizu Hiroshi Eda Libo Zhou Hidemitsu Okabe |
| author_sort | Jun Shimizu |
| collection | DOAJ |
| description | This study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this paper, the effects of adhesion (or lubrication) between a Si wafer and a diamond abrasive on the material removal and tool wear were analyzed by means of the molecular dynamics simulation. A few simulations were performed with changing the dissociation (cohesion) energy of a Morse potential function between a pair of Si and C atoms to evaluate the influence of adhesion on the material removal process. As a result, a trend similar to the actual diamond grinding process of silicon wafer was confirmed, which suggested that the reduction in adhesion (or proper lubrication) is effective for the reduction in subsurface damages, grinding forces, grinding temperature and tool wear, but may lead to reduction in the material removal rate as well. |
| first_indexed | 2024-12-18T23:50:39Z |
| format | Article |
| id | doaj.art-ff5b3883900f4192a7e4a44ffbec529a |
| institution | Directory Open Access Journal |
| issn | 1881-2198 |
| language | English |
| last_indexed | 2024-12-18T23:50:39Z |
| publishDate | 2008-10-01 |
| publisher | Japanese Society of Tribologists |
| record_format | Article |
| series | Tribology Online |
| spelling | doaj.art-ff5b3883900f4192a7e4a44ffbec529a2022-12-21T20:46:59ZengJapanese Society of TribologistsTribology Online1881-21982008-10-013524825310.2474/trol.3.248trolMolecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon WaferJun Shimizu0Hiroshi Eda1Libo Zhou2Hidemitsu Okabe3Department of Intelligent Systems Engineering, Ibaraki UniversityDepartment of Intelligent Systems Engineering, Ibaraki UniversityDepartment of Intelligent Systems Engineering, Ibaraki UniversityDepartment of Intelligent Systems Engineering, Ibaraki UniversityThis study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this paper, the effects of adhesion (or lubrication) between a Si wafer and a diamond abrasive on the material removal and tool wear were analyzed by means of the molecular dynamics simulation. A few simulations were performed with changing the dissociation (cohesion) energy of a Morse potential function between a pair of Si and C atoms to evaluate the influence of adhesion on the material removal process. As a result, a trend similar to the actual diamond grinding process of silicon wafer was confirmed, which suggested that the reduction in adhesion (or proper lubrication) is effective for the reduction in subsurface damages, grinding forces, grinding temperature and tool wear, but may lead to reduction in the material removal rate as well.https://www.jstage.jst.go.jp/article/trol/3/5/3_5_248/_pdf/-char/ensilicon waferdiamond abrasivegrindingadhesionsubsurface damagetool wearmolecular dynamicsinteratomic potential |
| spellingShingle | Jun Shimizu Hiroshi Eda Libo Zhou Hidemitsu Okabe Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer Tribology Online silicon wafer diamond abrasive grinding adhesion subsurface damage tool wear molecular dynamics interatomic potential |
| title | Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| title_full | Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| title_fullStr | Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| title_full_unstemmed | Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| title_short | Molecular Dynamics Simulation of Adhesion Effect on Material Removal and Tool Wear in Diamond Grinding of Silicon Wafer |
| title_sort | molecular dynamics simulation of adhesion effect on material removal and tool wear in diamond grinding of silicon wafer |
| topic | silicon wafer diamond abrasive grinding adhesion subsurface damage tool wear molecular dynamics interatomic potential |
| url | https://www.jstage.jst.go.jp/article/trol/3/5/3_5_248/_pdf/-char/en |
| work_keys_str_mv | AT junshimizu moleculardynamicssimulationofadhesioneffectonmaterialremovalandtoolwearindiamondgrindingofsiliconwafer AT hiroshieda moleculardynamicssimulationofadhesioneffectonmaterialremovalandtoolwearindiamondgrindingofsiliconwafer AT libozhou moleculardynamicssimulationofadhesioneffectonmaterialremovalandtoolwearindiamondgrindingofsiliconwafer AT hidemitsuokabe moleculardynamicssimulationofadhesioneffectonmaterialremovalandtoolwearindiamondgrindingofsiliconwafer |