Reliability Sensibility Analysis of the PCB Assembly concerning Warpage during the Reflow Soldering Process
As a vital component of electronic products, the quality of the printed circuit board (PCB) assembly directly affects the applications and service life. During the reflow soldering process, the PCB assembly may suffer excessive warpage. Therefore, in order to avoid such a failure, this paper conduct...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-08-01
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| Series: | Mathematics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2227-7390/10/17/3055 |