Bouchard, P., Bernacki, M., Parks, D. M., & Engineering, M. I. o. T. D. o. M. (2016). Analysis of stress intensity factors and T-stress to control crack propagation for kerf-less spalling of single crystal silicon foils. Elsevier.
Chicago Style (17th ed.) CitationBouchard, P.-O, M. Bernacki, David Moore Parks, and Massachusetts Institute of Technology. Department of Mechanical Engineering. Analysis of Stress Intensity Factors and T-stress to Control Crack Propagation for Kerf-less Spalling of Single Crystal Silicon Foils. Elsevier, 2016.
MLA (9th ed.) CitationBouchard, P.-O, et al. Analysis of Stress Intensity Factors and T-stress to Control Crack Propagation for Kerf-less Spalling of Single Crystal Silicon Foils. Elsevier, 2016.
Warning: These citations may not always be 100% accurate.