Out-of-plane neural microelectrode arrays fabrication using conventional blade dicing
\This paper describes an optimized out-of-plane fabrication method for neural 3D high-aspect-ratio microelectrode array (MEA) based on a dicing technology platform (a standard procedure in semiconductor industry). The proposed MEA fabrication required important modifications in the dicing process. S...
| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Springer London
2017
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| Online Access: | http://hdl.handle.net/1721.1/106833 |