Pad Scratching in Chemical-Mechanical Polishing: The Effects of Mechanical and Tribological Properties

In chemical-mechanical polishing (CMP), even the soft pad asperities may, under certain conditions, generate scratches on the relatively hard surfaces being polished. In the present study, contact mechanics models of pad-induced scratching are formulated, and the effects of the hardness of the surfa...

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Bibliographic Details
Main Authors: Kim, Sanha, Saka, Nannaji, Chun, Jung-Hoon
Other Authors: Massachusetts Institute of Technology. Laboratory for Manufacturing and Productivity
Format: Article
Language:en_US
Published: Electrochemical Society 2017
Online Access:http://hdl.handle.net/1721.1/108056
https://orcid.org/0000-0002-3548-6173
https://orcid.org/0000-0002-8480-5572
https://orcid.org/0000-0003-1607-3581