Pad Scratching in Chemical-Mechanical Polishing: The Effects of Mechanical and Tribological Properties
In chemical-mechanical polishing (CMP), even the soft pad asperities may, under certain conditions, generate scratches on the relatively hard surfaces being polished. In the present study, contact mechanics models of pad-induced scratching are formulated, and the effects of the hardness of the surfa...
Main Authors: | , , |
---|---|
Other Authors: | |
Format: | Article |
Language: | en_US |
Published: |
Electrochemical Society
2017
|
Online Access: | http://hdl.handle.net/1721.1/108056 https://orcid.org/0000-0002-3548-6173 https://orcid.org/0000-0002-8480-5572 https://orcid.org/0000-0003-1607-3581 |