Pad Scratching in Chemical-Mechanical Polishing: The Effects of Mechanical and Tribological Properties
In chemical-mechanical polishing (CMP), even the soft pad asperities may, under certain conditions, generate scratches on the relatively hard surfaces being polished. In the present study, contact mechanics models of pad-induced scratching are formulated, and the effects of the hardness of the surfa...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Language: | en_US |
| Published: |
Electrochemical Society
2017
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| Online Access: | http://hdl.handle.net/1721.1/108056 https://orcid.org/0000-0002-3548-6173 https://orcid.org/0000-0002-8480-5572 https://orcid.org/0000-0003-1607-3581 |